RF analysis – Test network reflection characteristics and transmission characteristics of antennae, Wireless modules and PCBA.
Optical Microscope Inspection – Inspects the appearance and dimensions of devices and housing.
3D X-RAY inspection – Inspects the inner structure defects of components - voids, foreign materials, cracks, etc.
Scanning Acoustic Microscope inspection – Inspects the package defects at the internal boundaries of components – e.g. de-lamination, voids, bubbles, die cracks, etc.
I-V Curve Analysis – Inspects device electrical failures such as open, short and leakage.
Semiconductor Discrete Device Parametric Analysis – Measures the electrical characteristics of semiconductor devices.
LED Test – Measures the parameters such as spectrum power distributing, colour temperature, colour display exponent, wavelength, etc.
LCD /LCM Test – Measures parameters such as the viewing angle, colour gamut, grayscale, response time, luminance uniformity, chromaticity coordinates,etc.
Photo-electrical Characteristics Test – Measures parameters such as centre wavelength, spectral width, mean launched power, sensitivity, maximum average received optical power, BER , etc.